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Apple Starts Mass Production of M5 Chip: Here's What's New [Report]
Mass production of Apple's next-generation M5 chip for Mac and iPad has already begun, according to a new report from ETNews. The chip will allegedly adopt new process technology to enhance artificial intelligence (AI) performance.According to industry sources on the 5th, Apple began packaging the M5 chip last month. Packaging is the process of protecting the semiconductor die and enabling electrical connections with other components or devices. Apple entrusted Taiwan's TSMC with the front-end production of the M5 chip, which involves implementing the chip's circuitry. Now that the semiconductor dies have been manufactured, packaging firms (OSAT) have started turning them into final products.The M5 chip packaging is being handled by Taiwan's ASE, U.S.-based Amkor, and China's JCET. ASE was the first to begin mass production, with Amkor and JCET expected to follow sequentially.Continue ReadingShare Article:Facebook, Twitter, LinkedIn, Reddit, EmailFollow iClarified:Facebook, Twitter, LinkedIn, Newsletter, App Store, YouTube
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Mass production of Apple's next-generation M5 chip for Mac and iPad has already begun, according to a new report from ETNews. The chip will allegedly adopt new process technology to enhance artificial intelligence (AI) performance.
According to industry sources on the 5th, Apple began packaging the M5 chip last month. Packaging is the process of protecting the semiconductor die and enabling electrical connections with other components or devices. Apple entrusted Taiwan's TSMC with the front-end production of the M5 chip, which involves implementing the chip's circuitry. Now that the semiconductor dies have been manufactured, packaging firms (OSAT) have started turning them into final products.
The M5 chip packaging is being handled by Taiwan's ASE, U.S.-based Amkor, and China's JCET. ASE was the first to begin mass production, with Amkor and JCET expected to follow sequentially.
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According to industry sources on the 5th, Apple began packaging the M5 chip last month. Packaging is the process of protecting the semiconductor die and enabling electrical connections with other components or devices. Apple entrusted Taiwan's TSMC with the front-end production of the M5 chip, which involves implementing the chip's circuitry. Now that the semiconductor dies have been manufactured, packaging firms (OSAT) have started turning them into final products.
The M5 chip packaging is being handled by Taiwan's ASE, U.S.-based Amkor, and China's JCET. ASE was the first to begin mass production, with Amkor and JCET expected to follow sequentially.
Continue Reading
Share Article:
Facebook, Twitter, LinkedIn, Reddit, Email
Follow iClarified:
Facebook, Twitter, LinkedIn, Newsletter, App Store, YouTube
